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At the same time, In FO “reduces cost,” he asserted.
DARPA’s Daniel Green spoke about the agency’s Diverse Accessible Heterogeneous Integration (DAHI) program, which succeeded its Compound Semiconductor Materials on Silicon (COSMOS) program.
KC Yee of TSMC, filling in for an absent presenter, spoke at length about the foundry’s Integrated Fan-Out (In FO) wafer-level packaging technology.
“In FO eliminates silicon, TSVs, interposers,” he said.
He was followed by Augusto Gutierrez-Aitken of Northrop Grumman Aerospace Systems. NGAS is developing a foundry for heterogeneous integration projects, inviting in companies and universities to participate in the research and development.
Teledyne Scientific’s Miguel Urteaga spoke about his company’s CS-STACK 3D stacking chip program.
Wally Rhines, Chairman and CEO of Mentor Graphics, will kick things off at am with a keynote talk on “Merger Mania.“ Wally notes that in 2015, the transaction value of semiconductor mergers was at an all-time historic high.
Things are certainly consolidating, perhaps slowing down in the semiconductor market, so what’s going to drive the next wave of growth? These user sessions will be held at -am, -pm and -pm.“Innovation happens collectively.” While there has been much attention paid to the slowing growth in the smartphone market, mobile technology will continue to be a significant driver for the semiconductor industry, according to Cassidy.He reviewed the areas of mobile technology, the Internet of Things, and automotive electronics.“Io T will require an incredible amount of interconnection technology,” Cassidy said.Between Io T and automotive tech, there will be “a very significant amount of data that’s going to be needed to be stored and processed,” he added.
“We’re looking to get the highest III-V performance we can,” he said.